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Référence fabricant
MIC5060YML-TR
MIC5060 Series 30 V Ultra Small High Side MOSFET Driver - MLF-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC5060YML-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Microchip has released a new Datasheet for the Ultra-Small High-Side MOSFET Driver of devices.Description of Change:Updated Supply Current, Logic Input Voltage Threshold VIN, Logic Input Current MIC5060, Gate Turn-off Time, tOFF parameters in Electrical Characteristics table. Updated descriptions of Figure 5-2, Figure 5-3, Figure 5-4, Figure 5-5. Updated Figure 5-6 and Figure 5-7. Changed en dashes to hyphens where appropriate as per editing standards. Updated package marking drawing page and package outline drawing pages to most current format used for APID data sheets.Reason for Change: To improve productivity.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Update on Future PCN93909Revision History:November 8, 2022: Issued initial notification.October 6, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 8, 2023.Description of Change:Qualification of MMT as an additional assembly site for MIC5060YML-TR catalog part number (CPN) available in 8L VDFN (3x3x0.9mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:Yes. Update package max. thickness to 1.0mm.Reason for Change:To improve productivity and on time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:November 8, 2023 (date code: 2345)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change:Qualification of MTAI as an additional final test site for MIC5060YML-TR, MIC37303YML-T5 and MIC37303YML-TR catalog part numbers (CPN) available in 8L VDFN (3x3x0.9mm) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional final test site.Change Implementation Status:In ProgressEstimated First Ship Date:April 21, 2023 (date code: 2316)
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC5060YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/mic5060yml-tr-microchip-1008600
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC5060YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/mic5060yml-tr-microchip-1008600
Microchip MIC5060YML-TR - Caractéristiques techniques
| Configuration: | High Side |
| No of Outputs: | Single |
| Supply Voltage-Max: | 30V |
| Style d'emballage : | MLF-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
This device is designed for gate control of N-Channel, enhancement-mode, and power MOSFETs used as high-side or low-side switches and it can sustain an on-state output indefinitely.
Features:
- 2.75 V to 30 V operation
- 100 µA maximum supply current (5 V supply)
- 15 µA typical off-state current
- Internal charge pump
- TTL-compatible input
- Withstands 60 V transient (load dump)
- Reverse battery protected to -20 V
- Inductive spike protected to -20 V
- Overvoltage shutdown at 35 V
- Internal 15 V gate protection
- Minimum external parts
- Operates in high-side or low-side configurations
- 1 µA control input pull-off
- Available in 8-pin 3 mm x 3 mm MLF package
Applications:
- Notebook battery safety switches
- UMPC and web tablet battery protection
- Battery-powered computer power management
- General MOSFET switch applications
- Power bus switching
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-8
Méthode de montage :
Surface Mount