
Référence fabricant
MIC33M656-FAYMP-TR
Integrated Power Module
Microchip MIC33M656-FAYMP-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of UNIG as a new assembly site for selected MIC1344, MIC23099, MIC2785, MIC28, MIC33xx, MIC38xx, MIC45xx, MX55, MX57, MX85 and MXT57 device families available in various packages.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attachedQualification Plan:Please open the attachments included with this PCN labeled as PCN_#_Qual_Plan.Revision History:November 24, 2023: Issued initial notification.
Statut du produit:
Microchip MIC33M656-FAYMP-TR - Caractéristiques techniques
Topology: | Buck |
Input Voltage: | 2.4V to 5.5V |
Output Current-Max: | 6A |
Output Voltage Range: | 0.6V to 1.28V |
Output Type: | Programmable |
Switching Frequency-Max: | 2.2MHz |
Operating Temp Range: | -40°C to +125°C |
Duty Cycle-Max: | 100% |
Efficiency: | 95% |
No. of Outputs: | 1 |
Storage Temperature Range: | -65°C to +150°C |
Load Regulation (%): | 0.2% |
Product Status: | Active |
Style d'emballage : | B1QFN-53 |
Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1500 par Cut Tape
Style d'emballage :
B1QFN-53
Méthode de montage :
Surface Mount