Référence fabricant
MIC5305YML-TR
150MA UCAP ULTRA LDO REGULATOR
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-6 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC5305YML-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change: Qualification of UNIG as an additional final test site and scan and pack site for selected MIC5319, MIC2009, MIC2005, MIC5219, MIC47050, MIC5305, MIC5259, MIC5252, MIC5255, MIC5232 and MIC5247 device families available in 6L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Description of Change: Qualification of UNIS as an additional assembly site for selected MIC5305, MIC2772, MIC2602, MIC5232 and MIC2601 device families available in 8L and 6L VDFN (2x2x0.9mm) packages.Reason for Change:To improve on-time delivery performance by qualifying UNIS as an additional assembly site.
Statut du produit:
Microchip MIC5305YML-TR - Caractéristiques techniques
| Input Voltage-Min: | 2.25V |
| Input Voltage-Max: | 5.5V |
| Dropout Voltage-Max: | 110mV |
| Output Current-Max: | 150mA |
| Style d'emballage : | MLF-6 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MIC5305 is ideal for battery-operated applications, features 1% accuracy, extremely low-dropout voltage (60 mV @ 150 mA), and low ground current at light load (typically 90 µA). Equipped with a logic-compatible enable pin, the MIC5305 can be put into a zero-off-mode current state, drawing no current when disabled.
The MIC5305 is a µCap design operating with very small ceramic output capacitors for stability, thereby reducing required board space and component cost. The MIC5305 is available in ?xed output voltages and adjustable output voltages in the super-compact 6-pin 2 mm × 2 mm MLF ® leadless packag.
Features:
- Ultra-low dropout voltage of 60 mV @ 150 mA
- Input voltage range: 2.25 to 5.5 V
- Stable with ceramic output capacitor
- 150 mA guaranteed output current
- Low output noise — 20 µVrms
- Low quiescent current of 90 µA total
- High PSRR, up to 85 dB @ 1 kHz
- Less than 30 µs turn-on time w/C BYP = 0.01 µF
- High output accuracy:
- ±1.0% initial accuracy
- ±2.0% over temperature
- Thermal shutdown protection
- Current limit protection
- Tiny 6-pin 2 mm × 2 mm MLF ® package
Applications:
- Cellular phones
- PDAs
- Fiber optic modules
- Portable electronics
- Notebook PCs
- Audio Codec power supplies
Learn more about the MIC5305 family of Linear Regulators
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-6
Méthode de montage :
Surface Mount