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Référence fabricant
24AA256UIDT-I/ST
EEPROM Memory IC 256Kb (32K x 8) I²C 400kHz 900ns 8-TSSOP
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2500 par Reel | ||||||||||
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Microchip 24AA256UIDT-I/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of MMT as an additional assembly site for selected 24AA044, 24AA256UID, 24LC08B, 25AA256X, 25LC256X, 34AA04 and MCP9805 device families available in 8L TSSOP (4.4mm) package using CuPdAu wire.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using CuPdAu wire.Change Implementation Status:In ProgressEstimated First Ship Date:December 28, 2023 (date code: 2352)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
PCN Status: Final NotificationDescription of Change: Qualification of MMT as an additional assembly site for selected 24LC08B, 24AA0xx, 24AA256UID, 25LC256, 25AA256, 34AA04 and MCP9805 device families available in 8L TSSOP (4.4mm) package using CuPdAu bond wire material.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site using CuPdAu bond wire material.
Description of Change:Qualification of MMT as an additional assembly site for selected 24LC08B, 24AA0xx, 24AA256UID, 25LC256, 25AA256, 34AA04 and MCP9805 device families available in 8LTSSOP (4.4mm) package using CuPdAu bond wire material.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using CuPdAu bond wire material.
Microchip has released a new Datasheet for the 24AA256/24LC256/24FC256 256K I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change: Added 5-Lead SOT-23 package. Updated MSOP, PDIP, SOIC and SOIJ package drawings.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 28 Jul 2022
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
2500 par Reel