
Référence fabricant
25AA512-I/SN
25AA512 Series 512 Kbit (64K x 8) 5.5 V SMT SPI Bus Serial EEPROM - SOIC-8
Microchip 25AA512-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the 25AA512 512-Kbit SPI Bus Serial EEPROM Data Sheet of devices. Description of Change: Fixed clock bit count and page size errors on Byte Write and Page Write sequences. Made minor grammar and punctuation fixes throughout the document. Removed automotive product offering. Updated SOIC, PDIP and SOIJ package drawings.Reason for Change: To Improve Productivity
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Microchip has released a new Product Documents for the 25AA512 512 Kbit SPI Bus Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change: 1) Updated Pin Description section; 2) Updated Figure 1-3; 3) Updated Package Drawings; 4) Added Product Identification System for Automotive; 5) Replaced terminology �Master� and �Slave� with �Host� and �Client�, respectively. 6) Reformatted some sections for better readability.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 18 Aug 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:February 9, 2021: Issued final notification. Provided estimated first ship date to be February 19, 2021.March 22, 2021: Re-issued final notification. Attached the qualification report.Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designChange Implementation Status:In ProgressEstimated First Ship Date:February 19, 2021 (date code: 2108)
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame design.Estimated Qualification Completion Date:March 2021
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designEstimated First Ship Date: February 19, 2021 (date code: 2108)
Statut du produit:
Microchip 25AA512-I/SN - Caractéristiques techniques
Memory Density: | 512kb |
Memory Organization: | 64 K x 8 |
Supply Voltage-Nom: | 1.8V to 5.5V |
Clock Frequency-Max: | 20MHz |
Write Cycle Time-Max (tWC): | 5ms |
Style d'emballage : | SOIC-8 |
Méthode de montage : | Surface Mount |
$Fonctionnalités et applications
The 25AA512 is a 512 Kbit serial EEPROM memory with byte-level and page-level serial EEPROM functions. It also features Page, Sector and Chip erase functions typically associated with Flash-based products. These functions are not required for byte or page write operations.
The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled by a Chip Select (CS) input. Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 25AA512 is available in standard packages including 8-lead PDIP, SOIC, and advanced 8-lead DFN package. All packages are Pb-free and RoHS compliant.
Features:
- 20 MHz max. Clock Speed
- Byte and Page-level Write Operations
- 128-byte page
- 5 ms max.
- No page or sector erase required
- Low-Power CMOS Technology
- Max. Write Current: 5 mA at 5.5 V, 20 MHz
- Read Current: 10 mA at 5.5 V, 20 MHz
- Standby Current: 1 μA at 2.5 V (Deep powerdown)
- Electronic Signature for Device ID
- Self-Timed Erase and Write cycles
- Page Erase (5 ms, typical)
- Sector Erase (10 ms/sector, typical)
- Bulk Erase (10 ms, typical)
- Sector Write Protection (16 K byte/sector)
- Protect none, 1/4, 1/2 or all of array
- Built-In Write Protection
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
- High Reliability
- Endurance: 1 Million erase/write cycles
- Data Retention: >200 years
- ESD Protection: 4000 V
- Temperature Ranges Supported;
- Industrial (I): -40°C to +85°C
- Pb-free and RoHS Compliant
Learn more about the 25AA512 family of EEPROM
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount