Référence fabricant
MX30UF2G18AC-XKI
2Gb (x8) SLC NAND 1.8V 4-bit ECC 63-ball FBGA
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| Nom du fabricant: | Macronix | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :220 par Tray Style d'emballage :VFBGA-63 Méthode de montage :Surface Mount | ||||||||||
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Macronix MX30UF2G18AC-XKI - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Change die attach material for ASECL 63CSP package products.Reason of Change:The State of Maine in the United States issued a written notification (H.P.1113 L.D.1503 ) prohibit intentional addition of PFAS Perfluoroalkyl and Polyfluoroalkyl Substances material in all consumer products startingfrom Jan. 2030.Change Description:Please be informed that Macronix is going to replace the die attach material 63CSP package products assembled at ASECL. Before Change : Die attach material (w/ PFAS): Epoxy (Henkel, 2025D)After Change:Die attach material (PFAS-Free): Film (Resonac FH-900)
Statut du produit:
Macronix MX30UF2G18AC-XKI - Caractéristiques techniques
| NAND Type: | SLC |
| Memory Type: | Non-Volatile |
| Memory Format: | Flash |
| Memory Density: | 2Gb |
| Memory Organization: | 256 M x 8 |
| Supply Voltage-Nom: | 1.7V to 1.95V |
| Access Time-Max: | 25ns |
| Operating Temp Range: | -40°C to +85°C |
| Additional Feature: | Security Feature |
| Interface: | Parallel |
| Style d'emballage : | VFBGA-63 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
220 par Tray
Style d'emballage :
VFBGA-63
Méthode de montage :
Surface Mount