Référence fabricant
S25FL256SAGMFIR03
256 Mbit (32 Mbyte) 3.0V SPI Flash Memory
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1450 par Reel Style d'emballage :SOIC-16 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2520 | ||||||||||
Infineon S25FL256SAGMFIR03 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description:Change of wire bond from Cu to CuPdAu for industrial graded SOIC 16L packaged productsReason:Product harmonization of bond wire usage. CuPdAu wire enables superior electrical, thermal and reliability performance, making it an excellent interconnect solution for packaging to ensure business continuity and supply by streamlining its production.LTB - 2025-05-12LTS - 2025-08-12
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Statut du produit:
Infineon S25FL256SAGMFIR03 - Caractéristiques techniques
| Program Memory Type: | Flash |
| Clock Frequency-Max: | 133MHz |
| InterfaceType / Connectivity: | Quad SPI/SPI - Quad I/O |
| Memory Density: | 256Mb |
| Memory Organization: | 32M x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Temperature Grade: | Industrial |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Input Capacitance: | 8pF |
| Moisture Sensitivity Level: | 3 |
| Style d'emballage : | SOIC-16 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1450 par Reel
Style d'emballage :
SOIC-16
Méthode de montage :
Surface Mount