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Référence fabricant
ATTINY1604-SSFR
8-Bit 16MHz 16KB (16K x 8) FLASH 14-SOIC
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOIC-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip ATTINY1604-SSFR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=ATTINY1604-SSFR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--8-bit/attiny1604-ssfr-microchip-2178936
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=ATTINY1604-SSFR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--8-bit/attiny1604-ssfr-microchip-2178936
Microchip ATTINY1604-SSFR - Caractéristiques techniques
| Family Name: | ATtiny |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 1MB |
| Speed: | 16MHz |
| No of I/O Lines: | 12 |
| InterfaceType / Connectivity: | IrDA/I2C/LINbus/SPI |
| Peripherals: | Brown-out Detect/POR/Reset/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| Watchdog Timers: | 1 |
| Moisture Sensitivity Level: | 3 |
| Style d'emballage : | SOIC-14 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount