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Référence fabricant
MCP1702T-1802E/MB
LOW IQ 250MA LDO, VIN 13.2V MAX, VOUT=1.8V
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :SOT-89 (SC-62) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP1702T-1802E/MB - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP1702, MCP1703 and MCP1703A device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Revision History:August 30, 2023: Issued initial notification.September 7, 2023: Re-issued initial notification to remove MCP1700T-1802E/MBV05.January 23, 2024: Issued final notification. Updated post change paddle size from 71x79mils to 72x81mils and included backside coat details. Attached Qual Report and added the estimated first ship date on February 15, 2024.Description of Change:Qualification of GTBF as an additional assembly site for selected MCP11xT-xx, MCP170xT-xx, MCP170xRT-xx and MCP1703AT-xx device families available in 3L SOT-89 package.Reason for Change:To improve on-time delivery performance by qualifying GTBF as an additional assembly site.
Revision History:August 30, 2023: Issued initial notification.September 7, 2023: Re-issued initial notification to remove MCP1700T-1802E/MBV05.Description of Change:Qualification of GTBF as an additional assembly site for selected MCP11xT-xx, MCP170xT-xx, MCP170xRT-xx and MCP1703AT-xx device families available in 3L SOT-89 package.Reason for Change:To improve on-time delivery performance by qualifying GTBF as an additional assembly site.
Microchip has released a new Datasheet for the MCP1702 250 mA Low Quiescent Current LDO Regulator of devices. Notification Status: FinalDescription of Change:? Added automotive qualification to the Features section and examples to the PRODUCT IDENTIFICATION SYSTEM page.? Updated Section 7.0 ?Packaging Information? with the latest package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 March 2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1702T-1802E/MB&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1702t-1802e-mb-microchip-5850573
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1702T-1802E/MB&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1702t-1802e-mb-microchip-5850573
Microchip MCP1702T-1802E/MB - Caractéristiques techniques
| Input Voltage-Min: | 2.7V |
| Input Voltage-Max: | 13.2V |
| Output Voltage Fixed: | 1.8V |
| Dropout Voltage-Max: | 1100mV |
| Output Current-Max: | 250mA |
| Style d'emballage : | SOT-89 (SC-62) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
SOT-89 (SC-62)
Méthode de montage :
Surface Mount