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Référence fabricant
ATMEGA1281-16AU
ATmega Series 128 KB Flash 8 KB SRAM 16 MHz 8-Bit Microcontroller - TQFP-64
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :90 par Tray Style d'emballage :TQFP-64 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2433 | ||||||||||
Microchip ATMEGA1281-16AU - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***June 12, 2024: Issued cancellation notification***Description of Change:This qualification was originally performed to qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.Reason for Change:Microchip has decided to not qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.
Revision History:July 27, 2023: Issued initial notification.February 05, 2024: Updated affected parts list to remove CPN ATMEGA64L-8AQRA1 due to already EOL; Issued cancellation notification.Reason for Change:Microchip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected AT90CANxx, AT90USBxx and ATMEGAxx device families available in 64L and 100L TQFP (14x14x1mm) packages at MMT assembly site.
PCN Status: Final NotificationDescription of Change: Qualification of ASE9 as a new final test site for selected ATMEGA12xx, ATMEGA32xx, ATMEGA64xx, ATMEGA16xx and ATMEGA25xx device families available in 64L TQFP (14x14x1mm) package.Reason for Change: To improve productivity by qualifying ASE9 as a new final test site.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected AT90CANxx, AT90USBxx and ATMEGAxx device families available in 64L and 100L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire at MMT assembly site.Change Implementation Status:In Progress
Description of Change:Qualification of ASE9 as an additional final test site for selected ATMEGA12xx, ATMEGA32xx, ATMEGA64xx, ATMEGA16xx and ATMEGA25xx device families available in 64L TQFP(14x14x1mm) package.Reason for Change:To improve productivity by qualifying ASE9 as an additional final test site.
Microchip has released a new Errata for the ATmega640/1280/1281/2560/2561 Silicon Errata and Data Sheet Clarification of devices.Description of Change:The initial release of this document? Errata content moved from the data sheet and restructured to the new document template? Data sheet clarifications added:? Packaging Information: 3.2.1. 100-Ball CBGA? System Clock and Clock Options: 3.3.1. System Clock and Clock Options? Output Compare Modulator: 3.4.1. Output Compare Modulator in ATmega640/1280/1281/2560/2561? Interrupts: 3.5.1. Interrupt Vectors in ATmega640/1280/1281/2560/2561
Statut du produit:
Microchip ATMEGA1281-16AU - Caractéristiques techniques
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 8kB |
| Speed: | 16MHz |
| No of I/O Lines: | 54 |
| InterfaceType / Connectivity: | EBI/EMI/I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 6 |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 8-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | TQFP-64 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
90 par Tray
Style d'emballage :
TQFP-64
Méthode de montage :
Surface Mount
