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Référence fabricant
SY89645LK4G
1:4 CMOS/LVTTL-TO-LVDS TRANSLATOR+ FANOUT BUFFER
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :74 par Tube Style d'emballage :TSSOP-20 Méthode de montage :Surface Mount |
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Microchip SY89645LK4G - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Statut du produit:
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Microchip SY89645LK4G - Caractéristiques techniques
| Type: | Clock Buffer |
| Clock Output Frequency - Max: | 650MHz |
| Supply Voltage-Nom: | 3.135V to 3.465V |
| Style d'emballage : | TSSOP-20 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
74 par Tube
Style d'emballage :
TSSOP-20
Méthode de montage :
Surface Mount