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Référence fabricant
MIC2204YML-TR
MIC2204 Series 5.5 V 2 MHz High-Efficiency Synchronous Buck Converter - MLF-10
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| Nom du fabricant: | Microchip | ||||||||||
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Product Variant Information section
Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-10 Méthode de montage :Surface Mount |
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Microchip MIC2204YML-TR - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
***UPDATE OF PCN111831***Revision History: March 27, 2025: Issued initial notification.October 23, 2025: Issued final notification. Updated affected parts list to add MIC5247-1.5YML-TR catalog part number (CPN). Attached the Qualification Report. Provided estimated first ship date to be on October 25, 2025.Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for selected MIC5247, MIC5255, MIC5232, MIC5259, MIC5256, MIC5253, MIC5265, MIC5159, MIC5252, MIC5249, MIC5264, MIC2202, MIC2203, MIC2204, MIC2213, MIC2214, MIC2215, MIC2210, MIC2211, and MIC2212 device families of 28k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 25 October 2025 (date code: 2543)
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change:? Minor grammatical and stylistic changes throughout.? Updated Functional Block Diagram.? Updated Absolute Maximum Ratings.? Updated Equation 5-3 and Equation 5-4.? Updated the Package Marking Information and the Package Outline Drawings.? Updated the Product Identification System.Reason for Change: To Improve Productivity
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC5247, MIC5255, MIC5232, MIC5259, MIC5256, MIC5253, MIC5265, MIC5159, MIC5252, MIC5249, MIC5264, MIC2202, MIC2203, MIC2204,MIC2213, MIC2214, MIC2215, MIC2210, MIC2211, and MIC2212 device families of 28k technology available in various packages. Pre and Post Summary Changes: See attached for more detailsImpacts to Datasheet: NoneChange Impact: NoneReason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status: In ProgressEstimated Qualification Completion Date: November 2025Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Timetable Summary: See attached document for more detailsRevision History: March 27, 2025: Issued initial notification.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**FPCN97963 UPDATE**Revision History:May 10, 2023: Issued initial notification.June 21, 2024: Issued final notification. Attached the Qualification Report. Revised the Notification Subject to specify all affected device families. Provided estimated first ship date to be on July 19, 2024.Description of Change:Qualification of UNIG as an additional final test site for LM2574, LM2575, MIC2145, MIC2202, MIC2203, MIC2204, MIC2981, MIC4574, MIC4826, MIC4827, MIC4830, MIC4832, MIC4833, MIC5800, MIC5801, MIC5891, MIC58P01 and MIC59P50 device families available in Tube and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as an additional final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC2204YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--switching-regulators/mic2204yml-tr-microchip-3358934
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC2204YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--switching-regulators/mic2204yml-tr-microchip-3358934
Microchip MIC2204YML-TR - Caractéristiques techniques
| Topology: | Buck |
| Input Voltage: | 2.3V to 5.5V |
| Output Current-Max: | 600mA |
| Switching Frequency-Max: | 2MHz |
| Style d'emballage : | MLF-10 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MIC2204 is available in 10-pin MSOP and 3 mm x 3 mm MLF™-10L package options with an operating junction temperature range from –40°C to 125°C .
Features:
- Input voltage range: 2.3 V to 5.5 V
- Output down to 1V/ 600 mA
- 2 MHz PWM operation
- Ultra-fast transient response (typical 200 kHz GBW)
- Internal compensation
- All ceramic capacitors
- >95% efficiency
- Fully integrated MOSFET switches
- Easily synchronized to external clock
- SYNCLOCK feature to daisy chain multiple 2204s
- <340£gA quiescent current
- Logic controlled micropower shutdown
- Thermal shutdown and current limit protection
- 10-pin MSOP and 3mm x 3mm MLF™-10L
- –40°C to +125°C junction temperature rang
Applications:
- High efficiency portable power
- Cellular phones
- PDAs
- 802.11 WLAN power supplies
- RF power supplies
- Li Ion battery powered applications
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-10
Méthode de montage :
Surface Mount