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Référence fabricant
MIC23050-CYML-TR
MIC23050 Series 4.6MHz 600mA Sync Buck Regulator w/ HyperLight Load™ Mode-MLF-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC23050-CYML-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
***UPDATE OF PCN112600 & PCN112910***Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.Estimated First Ship Date: 18 July 2025 (date code: 2529)Revision History: April 29, 2025: Issued initial notification.May 14, 2025: Re-issued initial notification to update the dimensions of the T/R antistatic shield bag of UNIG from inches to mm for both length and width and mils to mm for thickness.July 02, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on July 18, 2025.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
******FPCN112600 UPDATE******Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8LVDFN(2x2x0.9mm).***Re-issued initial notification to update the dimensions of the T/R antistatic shield bag of UNIG from inches to mm for both length and width and mils to mm for thickness***Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC23050-CYML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--switching-regulators/mic23050-cyml-tr-microchip-7008595
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC23050-CYML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--switching-regulators/mic23050-cyml-tr-microchip-7008595
Microchip MIC23050-CYML-TR - Caractéristiques techniques
| Topology: | Buck |
| Input Voltage: | 2.7V to 5.5V |
| Output Current-Max: | 600mA |
| Switching Frequency-Max: | 4.6MHz |
| Style d'emballage : | MLF-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MIC23050-CYML TR is a high efficiency 600 mA PWM synchronous buck (step-down) regulator with a very low typical quiescent current draw of 20 µA and it can achieve over 89% efficiency even at 1 mA.
Features:
- Input voltage range: 2.7V to 5.5V
- 600mA output current
- Fixed output voltage from 0.72V to 3.3V
- Ultra fast transient response
- 20µA typical quiescent current
- 4MHz in PWM in constant current mode
- 0.47µH to 2.2µH inductor
- Low voltage output ripple
- 25mVpp in HyperLight Load® mode
- 3mV output voltage ripple in full PWM mode
- >93% efficiency
- ~89% at 1mA
- Micropower shutdown
- Available in 8-pin 2mm x 2mm MLF®
- -40°C to +125°C junction temperature range
Applications:
- Cellular phones
- Digital cameras
- Portable media players
- Wireless LAN cards
- WiFi/WiMax/WiBro modules
- USB-powered devices
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-8
Méthode de montage :
Surface Mount