Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
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Référence fabricant
AT24C02C-SSHM-T
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4000 par Reel
SOIC-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
***UPDATE OF PCN112076 & PCN114907***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025. August 6, 2025: Re-issued final notification to update the attachment.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
***UPDATE OF PCN112076***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AT24C04C, AT24C02C, AT24C01C, AT24C32D, AT24C256C, ATtiny25, ATtiny13A, ATtiny13, 25LC256, 25AA256, 25LC128 and 25AA128 device families available in 8L SOIC (.150in).Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5). Estimated Qualification Completion Date: May 2025
Statut du produit:
Sur commande
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
