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Amphenol Communications Solutions | DILB8P-223TLF

Manufacturer Part #

DILB8P-223TLF

8 Position 2.54 mm Pitch Open Frame Through Hole DIP Socket

ECAD Model:
Mfr. Name: Amphenol Communications Solutions
Standard Pkg:
Product Variant Information section
Date Code: 2547
Product Specification Section
Amphenol Communications Solutions DILB8P-223TLF - Technical Attributes
Attributes Table
Type: DIP Socket
Style: PCB Through Hole
No of Pins: 8
Termination Style/Mounting: Solder
Terminal Pitch: 2.54mm
Contact Material: Copper Alloy
Contact Plating: Matte-Tin
Rated Current: 1A
Material: Polyamide
Insulation Resistance: 1000MΩ
Operating Temp Range: -55°C to +105°C
No of Rows: 2
Dielectric Withstanding Voltage: 1000V
Mounting Method: Through Hole
Pricing Section
Global Stock:
18,000
USA:
18,000
On Order:Order inventroy details
18,000
Factory Stock:Factory Stock:
0
Factory Lead Time:
10 Weeks
Minimum Order:
60
Multiple Of:
60
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Tariff charges may apply if shipping to the United States. An estimate of tariff charges will be calculated at checkout.
Total
$8.58
USD
Quantity
Unit Price
60
$0.143
300
$0.139
1,200
$0.135
3,000
$0.133
7,500+
$0.128
Product Variant Information section