Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Référence fabricant
MSC025SMA120B4
1200 V 103A 500W Through Hole Silicon Carbide N-Channel Power MOSFET-TO-247-4
|
|
|||||||||||
|
|
|||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :30 par Tube Méthode de montage :Through Hole |
||||||||||
| Code de date: | |||||||||||
Microchip MSC025SMA120B4 - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
***UPDATE OF PCN111361***Description:Implement packing material changes for selected PSDS and SIC products available on TO-220, TO-247 and TO-263 packages at FSTS final test site.Reason for Change: To improve productivity by implementing packing material changes for selected PSDS and SIC products.Estimated First Ship Date: 16 June 2025 (date code: 2525)Revision History: March 06, 2025: Issued initial notification.June 9, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 16, 2025.
Description of Change:Implement packing material changes for selected PSDS and SIC products available in SOT-227, TO-220, TO-247, TO-263 and TO-268 packages at FSTS and TEAM final test sites.Reason for Change:To improve productivity by implementing packing material changes for selected PSDS and SIC products.
***June 27, 2024: Re-issued final notification. Updated the affected parts list to include CPN MSC035SMA070BV01 based on the updated scope***Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:May 12, 2023: Issued initial notification.May 28, 2024: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.Reason for Change:Microchip has decided to not qualify Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.
Revision History:February 26, 2024: Issued initial notification.May 24, 2024: Issued final notification. Revised the affected parts list. Provided estimated first ship date to be on June 29, 2024.Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:May 09, 2023: Issued initial notification.December 05, 2023: Re-issued initial notification to add MSC025SMA120D/S-C25, MSC017SMA120D/S-C25, MSC040SMA120D/S-C25, MSC080SMA120D/S-C25,MSC015SMA070D/S-C25, MSC060SMA070D/S-C25, MSC035SMA170D/S-C25 catalog part numbers (CPNs) in the affected parts list.Revision of Qual Report Availability and Final PCN Issue Date from ?September 29, 2023? to ?August 30, 2024?.Description of Change:Implementation of Die Overcoat material with Polyimide layer selected Microsemi SIC MOSFET product of MSCxxxSMA070, MSCxxxSMA120, and MSCxxxSMA170 devicefamilies in DICE, SOT-227, TO-247, TO-263 and TO-268 packages.Reason for Change:To improve productivity by implementing Die Overcoat (polyimide layer)
Statut du produit:
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MSC025SMA120B4&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--transistors--silicon-carbide-mosfets-sic-mosfets/msc025sma120b4-microchip-3147608
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MSC025SMA120B4&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--transistors--silicon-carbide-mosfets-sic-mosfets/msc025sma120b4-microchip-3147608
Microchip MSC025SMA120B4 - Caractéristiques techniques
| Technology: | SiCFET (Silicon Carbide) |
| Product Status: | Active |
| Fet Type: | N-Ch |
| No. of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 1200V |
| Drain Current: | 103A |
| Input Capacitance: | 3020pF |
| Power Dissipation: | 500W |
| Operating Temp Range: | -55°C to +175°C |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
30 par Tube
Méthode de montage :
Through Hole