Référence fabricant
MIC5235-2.8YM5-TR
IC REG LINEAR 2.8V 150MA SOT23-5
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23 (SC-59,TO-236) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC5235-2.8YM5-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for MIC5233, MIC5295, MIC5225, MIC5235 and MIC3490 device families of 21K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 12 December 2025 (date code: 2550)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5207, MIC5209, MM5450, MM5451, MIC38C44, MIC38C45, MIC38C42, MIC38C43, MIC5233, MIC5205, MIC5235, MIC5219, MIC5225, MIC4684, MIC5239, MIC5236, MIC5234,MIC5238, MIC5210, MIC79050, MIC5212, MIC5201, MIC3490, MIC4685, MIC5295, MIC4680, and MIC5237 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700 as a new mold compound material for selected Micrel MIC3490, MIC52xx, MIC62xxxM5, SPN020xxxx device families available in 5L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve manufacturability by qualifying G700 mold compound material and DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:November 15, 2022 (date code: 2247)
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700 as a new mold compound material for selected Micrel MIC3490, MIC52xx, MIC62xxxM5, SPN020xxxx device families available in 5L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve manufacturability by qualifying G700 mold compound material and DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:November 15, 2022 (date code: 2247)
Statut du produit:
Microchip MIC5235-2.8YM5-TR - Caractéristiques techniques
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 24V |
| Output Voltage Fixed: | 2.8V |
| Dropout Voltage-Max: | 310mV |
| Output Current-Max: | 150mA |
| Rated Power: | 0.42W |
| Operating Temp Range: | -65°C to +150°C |
| Regulator Topology: | Fixed |
| No. of Outputs: | Single |
| Load Regulation (%): | 1% |
| Line Regulation (%): | 0.04% |
| Style d'emballage : | SOT-23 (SC-59,TO-236) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23 (SC-59,TO-236)
Méthode de montage :
Surface Mount