Référence fabricant
MSCSM120AM03CT6LIAG
1200V 805A 3.215kW Chassis Mount SiC MOSFET Power Module
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1 par Bag Style d'emballage :Module Méthode de montage :Chassis Mount | ||||||||||
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Microchip MSCSM120AM03CT6LIAG - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:January 17, 2023: Issued initial notification.September 15, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 6, 2023.Description of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP6LI package.Reason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.
Description of Change:Qualification of MP3B as a new assembly site for selected Microsemi products available in SP6Reason for Change:To improve on-time delivery performance by qualifying MP3B as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2023
Statut du produit:
Microchip MSCSM120AM03CT6LIAG - Caractéristiques techniques
| Technology: | SiCFET (Silicon Carbide) |
| Product Status: | Active |
| Fet Type: | Dual N-Ch |
| No. of Channels: | 2 |
| Drain-to-Source Voltage [Vdss]: | 1200V |
| Drain Current: | 805A |
| Input Capacitance: | 30200pF |
| Power Dissipation: | 3.215kW |
| Operating Temp Range: | -40°C to +175°C |
| Style d'emballage : | Module |
| Méthode de montage : | Chassis Mount |
Emballages disponibles
Qté d'emballage(s) :
1 par Bag
Style d'emballage :
Module
Méthode de montage :
Chassis Mount