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Référence fabricant
MIC5365-1.8YMT-TZ
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10000 par Reel
TMLF-4
Surface Mount
Informations de livraison:
Le pays d’origine (COO) est attribué au moment de l’expédition et ne peut pas être sélectionné lors du processus de commande. Tous les documents indiqueront le COO au moment de l’expédition.
Code HTS:
ECCN:
Informations PCN:
*** Update for PCN 115457/MULTI CHANGE ***Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5317, MIC5361, MIC5362, MIC5365, MIC5366 and MIC5376 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: January 2026Revision History: August 22, 2025: Issued initial notification.September 04, 2025: Re-issued initial notification to update die attached material from "ATB-F125E" to "CDF215".
Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5317, MIC5361, MIC5362, MIC5365, MIC5366 and MIC5376 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Cancellation of Future PCN 113305.Revision History: May 30, 2025: Issued initial notification.August 15, 2025: Issued cancellation notification.CCB 7634 Cancellation Notice: For the qualification of ATP7 as an additional assembly site for selected MIC5362, MIC5361, MIC5376, MIC5317, MIC5366 and MIC5365 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Description of Change: For the qualification of ATP7 as an additional assembly site for selected MIC5362, MIC5361, MIC5376, MIC5317, MIC5366 and MIC5365 device families available in 4L UDFN (1.0x1.0x0.6mm) package.
***UPDATE OF PCN112765***Description:Qualification of STAR as an additional final test site and scan and pack site for selected MIC5504, MIC5361, MIC5362, MIC5365, MIC5317, MIC5366, MIC5502, MIC5524, MIC5503 and MIC5501 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.Revision History: May 07, 2025: Issued initial notification.June 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 28, 2025.
Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC5362, MIC5361, MIC5376, MIC5317, MIC5366 and MIC5365 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: December 2025
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC5504, MIC5361, MIC5362, MIC5365, MIC5317, MIC5366, MIC5502, MIC5524, MIC5503 and MIC5501 device families available in 4L UDFN (1.0x1.0x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Statut du produit:
This device includes an auto-discharge feature that is activated when the enable pin is low and is capable of sourcing 150 mA output current and offers high PSRR, making it a great solution for any portable electronic application.
Features:
Applications:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.