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MCP23S08-E/SO
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42 par Tube
SOIC-18
Surface Mount
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Product Category: Interface- Serial PeripheralsNotification Subject: Data Sheet - MCP23008 and MCP23S08 Data SheetDescription of Change:Revision I (February 2026)Corrected Byte and Sequential Read in Figure 1-1.Reason for Change: To improve productivity.Date Document Changes Effective: 13 Mar 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
The MCP23S08 series device provides 8-bit, general purpose, parallel I/O expansion for I2C bus or SPI applications. The two devices differ in the number of hardware address pins and the serial interface:• MCP23008 – I2C interface; three address pins• MCP23S08 – SPI interface; two address pins
The MCP23X08 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits. The data for each input or output is kept in the corresponding Input or Output register. The polarity of the Input Port register can be inverted with the Polarity Inversion register. All registers can be read by the system master.
Features:
View the complete product family of MCP23S08 series I2C
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