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Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
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Référence fabricant
KSZ8001LI-TR
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
1000 par Reel
LQFP-48
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Product Category: Ethernet PhysDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and CRM-1150B as a new die attach material for KSZ8001L, KSZ8001LI, KSZ8001LTR, KSZ8001LI-TR, KSZ8721BL, KSZ8721BLI, KSZ8721BL-TR, KSZ8721BLI-TR, KSZ8721CL and KSZ8721CL-TR catalog part numbers (CPN) available in 48L LQFP (7x7x1.4mm) package at OSE assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and CRM-1150B as a new die attach material at OSE assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: February 2027
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
PCN Status:Final NotificationDescription of Change:Qualification of ASEM as an additional assembly site for selected KSZ8001 and KSZ8721 device families available in 48L LQFP (7x7x1.4mm) package.Reason for Change:To improve on-time delivery performance by qualifying ASEM as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:October 11, 2024 (date code: 2441)
Description of Change:Qualification of ASEM as an additional assembly site for selected KSZ8001 and KSZ8721 device families available in 48L LQFP (7x7x1.4mm) package.Reason for Change:To improve on-time delivery performance by qualifying ASEM as an additional assembly site.
Revision History:anuary 25, 2023: Issued initial notification.November 30, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2024Description of Change:Qualification of EN4900G as a new Bottom Die attach material for selected KSZ8001 and KSZ8721 device families available in 48L TQFP (7x7x1.4mm) package.Reason for Change:To improve manufacturability by qualifying EN4900G as a new Bottom Die attach material.
Description of Change:Qualification of EN4900G as a new Bottom Die attach material for selected KSZ8001 and KSZ8721 device families available in 48L TQFP (7x7x1.4mm) package.Reason for Change:To improve manufacturability by qualifying EN4900G as a new Bottom Die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2023
Statut du produit:
The KSZ8001LI TR is a 10BASE-T/100BASE-TX/100BASE-FX physical layer transceiver, available in surface mount LQFP-48 package.
This device operating the core at 1.8 volts to meet low voltage and low power requirements. The solution provides MII/RMII/SMII interfaces to transmit and receive data. A unique mixed-signal design extends signaling distance while reducing power consumption.
Features:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
