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ATMEGA6490-16AUR
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1500 par Std. Mfr. Pkg
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Implement MSL-3 for selected products available in 64L, 100L and 128L TQFP (14x14x1mm) packages at MMT assembly siteReason for Change: To improve productivity by implementing MSL-3 for selected products.Estimated First Ship Date: 09 November 2026 (date code: 2646)
*** Update of FPCN 120720 / Tape&Reel Change ***Revision History: April 21, 2026: Issued final notification.May 20, 2026: Re-issued final notification to update PCN title and Description of Change in the PCN letter. Updated affected parts list to add KSZ8895MLXI-TR-H, KSZ8895MLXI-TR-H2, KSZ8895MLUB-TRV01 and KSZ8895MLUB-TRV01-MB catalog part numbers (CPN).Description of Change: Implement new carrier tape pocket design for AT89C55WD-24AUR, ATMEGA128L-8AURA6, ATMEGA324A-AURA3, ATMEGA164PA-ANR, ATMEGA3250V8AUR, ATMEGA3250-16AUR, ATMEGA3290-16AUR, ATMEGA3290V-8AUR, ATMEGA6450V8AUR, ATMEGA6450-16AUR, ATMEGA6490-16AUR, ATMEGA6490V-8AUR, ATMEGA851516AUR, ATMEGA32L-8AURA4, ATMEGA165PV-8ANR, ATMEGA165P-16ANR, ATMEGA324P20AURA0, ATMEGA164P-20AQRA1, ATMEGA3290PV-10AUA0, ATMEGA3250PV-10AUR, ATMEGA3290PV-10AUR, ATMEGA3290P-20AUR, ATMEGA3250P-20AUR, AT89LS52-16AUR, KSZ8841-16MVL-TR, KSZ8842-16MVL-TR, KSZ8841-16MVLI-TR, KSZ8842-16MVLI-TR, KSZ8895MLUB-TR, KSZ8895MLXI-TR, KSZ8895MLXI-TR-H, KSZ8895MLXI-TR-H2, KSZ8895MLUB-TRV01 and KSZ8895MLUB-TRV01-MB catalog part numbers (CPN) available in various packages at OSE final test site.Reason for Change: To improve manufacturability by implementing new carrier tape design.Estimated First Ship Date: 19 May 2026 (date code: 2621)
Description of Change: Implement new carrier tape pocket design for AT89C55WD-24AUR, ATMEGA128L-8AURA6, ATMEGA324A-AURA3, ATMEGA164PA-ANR, ATMEGA3250V8AUR, ATMEGA3250-16AUR, ATMEGA3290-16AUR, ATMEGA3290V-8AUR, ATMEGA6450V8AUR, ATMEGA6450-16AUR, ATMEGA6490-16AUR, ATMEGA6490V-8AUR, ATMEGA851516AUR, ATMEGA32L-8AURA4, ATMEGA165PV-8ANR, ATMEGA165P-16ANR, ATMEGA324P20AURA0, ATMEGA164P-20AQRA1, ATMEGA3290PV-10AUA0, ATMEGA3250PV-10AUR, ATMEGA3290PV-10AUR, ATMEGA3290P-20AUR, ATMEGA3250P-20AUR, AT89LS52-16AUR, KSZ8841-16MVL-TR, KSZ8842-16MVL-TR, KSZ8841-16MVLI-TR, KSZ8842-16MVLI-TR, KSZ8895MLUB-TR and KSZ8895MLXI-TR catalog part numbers (CPN) available in various packages at OSE final test site.Reason for Change: To improve manufacturability by implementing new carrier tape design.Estimated First Ship Date: 19 May 2026 (date code: 2621)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected AT90CAN32, AT90CAN64, ATmega128, ATmega128A, ATMEGA165xx, ATmega169xx, ATmega325, ATmega325xx, ATmega329, ATmega329xx, ATmega64, ATmega64A, ATmega645, ATmega645xx, ATmega649 and ATmega6490xx device families available in 64L and 100L TQFP (14x14x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MMT assembly site.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final Notification.Revision History: March 19, 2025: Issued initial notification.July 21, 2025: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on August 26, 2025.Description of Change:Qualification of MTAI as an additional final test site for selected ATMEGA3250, ATMEGA3250P, ATMEGA3290, ATMEGA3290P, ATMEGA6450, and ATMEGA6490 device families available in 100L TQFP (14x14x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional final test site.Change Implementation Status:In ProgressEstimated First Ship Date:26 August 2025 (date code: 2535)
Description of Change: Qualification of MTAI as an additional final test site for selected ATMEGA3250, ATMEGA3250P, ATMEGA3290, ATMEGA3290P, ATMEGA6450, and ATMEGA6490 device families available in 100L TQFP (14x14x1mm) package.Reason for Change: To improve manufacturability by qualifying MTAI as an additional final test site.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
