Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
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Référence fabricant
1410187-3
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17 par Tube
Through Hole
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
***UPDATE OF PCN112844, PCN112845 - extend the due date to allow mixed shipments***General Product Description:MULTIGIG RT2, RT2-R, RT3 Daughtercard Connectors with Differential WafersDescription of ChangesPlease refer to TE PCNs P-25-028147 and P-25-028148. This is a NOTIFICATION ONLY / NO ACTION NEEDED and will take effect immediately. This is to extend the due date of mixed shipments of both the existing and new design of the differential wafers per the referred TE PCNs. There are no further changes to the component parts.Reason for Changes:Product improvement. Due date for mixed shipments per TE PCNs P-25-028147 and P-25-028148 has expired. This is to extend the due date to allow mixed shipments of component parts.First Date To Ship (Changed Parts Only):30-SEP-2026Last Date for Mixed Shipments: (Changed Parts Only): 31-MAR-2027
General Product Description:MULTIGIG Daughter Card ConnectorsDescription of ChangesBecause of our continuous effort to improve our process, we hereby inform you about a replacement duplicate stamping tool for the contacts used in the listed part numbers. The validation for this new tool is executed by following a strict procedure, which mitigates risk of negative influence on quality and ability to supply. This is not a Form, Fit, or Function change. An internal release based on our specifications will be executed before any parts are delivered. There is no last date for mix shipment because we will not mix contacts stamped on the old tool die and new tool die in the assemblies. There is no last date for mix shipment because we do not want to mix the contacts in the assemblies from the old die and new die.Reason for Changes:Product improvement. Tool Duplication. Current tool has increasing maintenance requirements and durability issues because of tool age. New tool is needed for efficient continued production.First Date To Ship (Changed Parts Only): 02-FEB-2026
Product Description: MULTIGIG Daughter Card ConnectorsKind of change: DrawingGeneral Description of ChangesOn TE Customer Drawing change 1.41 dimension TYP to 1.41 REF.Reason for Changes:Change TE Customer Drawing to be consistent with TE Production Drawing.First Ship Date of Changed Items (Changed Parts Only): 12-JAN-2026
Description of ChangesOutside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA.Reason for Changes:New manufacturing facility.First Date To Ship (Changed Parts Only): 15-OCT-2025Last Date for Mixed Shipments: (Changed Parts Only): 22-OCT-2025
*****DO NOT ISSUE/DUPLICATE TO FPCN112844******Description of ChangesCurrent Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification.Reason for Changes:Product improvement. This change contributes to our continued quality improvement, performance, and sustainability objectives.
******FPCN112844 UPDATE*******Description of Change:Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification.Reason for Change:Product improvement. This change contributes to our continued quality improvement, performance, and sustainability objectives.
Description of ChangesCurrent Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification.Reason for Changes:Product improvement. This change contributes to our continued quality improvement, performance, and sustainability objectives.Reason for Changes:Product improvement. This change contributes to our continued quality improvement, performance, and sustainability objectives.
Description of Change:Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process.Reason for Changes:Product improvement. Reduce FOD (Foreign Object Debris) during assembly process.
Subject: NOE-23-053 ? Multigig Daughtercard Connectors ? Update Update Summary:? Our supplier has provided an 8D report to TE Connectivity (TE) and we have completed our internal 8D report. This report is available upon request.? As previously communicated, our Risk Assessment testing is complete. Results showed that product performed per the TE Product Specification. We have internally dispositioned product Use-As-Is.? Because tested product performed per the Product Specification, we continue to recommend a use-as-is disposition to our customers.? We expect to issue a formal closure letter regarding this NOE no later than February 28, 2025.
Subject: NOE-23-053 ? Multigig Daughtercard Connectors ? UpdateUpdate Summary:Our supplier is conducting tests to identify root cause of the PCB tape test failure reported in our previous update. We expect results in late November 2024.Our supplier has provided on-site resources to 100% tape test current inventory of PCBs with TE supervision. No additional tape test failures have been identified to date.Our Risk Assessment testing is ongoing. The planned completion date is December 12, 2024.We will continue to supply parts that have been produced using 100% tape tested wafers and/or material from an alternate supplier.
Statut du produit:
Sur commande
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
