Manufacturer Part #
MIC2772-S3S3YML-TR
MIC2772 Series 2.93/2.93 V 140 ms Surface Mount Dual Voltage Supervisor - MLF-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:MLF-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC2772-S3S3YML-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Description of Change: Qualification of UNIS as an additional assembly site for selected MIC5305, MIC2772, MIC2602, MIC5232 and MIC2601 device families available in 8L and 6L VDFN (2x2x0.9mm) packages.Reason for Change:To improve on-time delivery performance by qualifying UNIS as an additional assembly site.
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Part Status:
Microchip MIC2772-S3S3YML-TR - Technical Attributes
| No of Outputs: | Dual |
| Threshold Voltage: | 2.93|V |
| Supply Voltage-Max: | 5.5V |
| Reset Timeout: | 140ms |
| Package Style: | MLF-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The two voltage supervisors are completely independent. Each functional block features an under-voltage detector, a delay-generator, and a de-bounced manual reset input. A wide choice of voltage thresholds is available. The reset output is asserted at power-on and any time the input voltage drops below the reference voltage. It remains asserted for the chosen timeout period after the input rises back above the threshold. Reset timeouts of 20, 140, and 1100ms (minimum) are available.
Features:
- Two independent voltage supervisors
- Directly replaces discrete supervisors
- Generates power-on reset pulses
- De-bounced manual reset Inputs
- Choice of voltage thresholds
- 20, 140, or 1100ms reset timeouts
- Reset output may be pulled above VCC
- Rejects brief input transients
- Ultra-small 2x2mm MLF package
Applications:
- Servers
- Embedded Controllers
- Telecommunications Systems
- Power Supply Sequencing
- Hot-swapping
- Power supplies
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-8
Mounting Method:
Surface Mount