Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
PIC24FJ256GB110-I/PF
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
90 par Tray
TQFP-100
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Implement MSL-3 for selected products available in 64L, 100L and 128L TQFP (14x14x1mm) packages at MMT assembly siteReason for Change: To improve productivity by implementing MSL-3 for selected products.Estimated First Ship Date: 09 November 2026 (date code: 2646)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Revision History:August 10, 2023: Issued initial notification.June 05, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 23, 2025. Updated the notification subject and description change.Note: The change described in this PCN does not alter Microchip's current regulatory compliance regarding the material content of the applicable product.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected dsPIC33FJ6xx, PIC18F96J6xx, PIC18F97J6xx, PIC24FJ64Gxx, PIC24FJ128xx, PIC24FJ192xx, PIC24FJ256xx, PIC24FJ96Gxx, dsPIC33FJ2xx, PIC24HJ64Gxx, dsPIC33FJ1xx, PIC24HJ128xx, PIC24HJ256xx and dsPIC33FJ3xx device families available in 64L and 100L TQFP (14x14x1 mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire asnew wire material for selected DSPIC33FJ128xxx, DSPIC33FJ256xxx, DSPIC33FJxxGSxxx,DSPIC33FJxxMxxx, PIC18F9xJxx and PIC24FJxxxGxxx device families available in 64L and 100L TQFP(14x14x1 mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with goldflash (CuPdAu) bond wire.
Statut du produit:
Microchip provides solutions for the entire performance range of 8-bit, 16-bit, and 32-bit microcontrollers, with a powerful architecture, flexible memory technologies, comprehensive easy-to-use development tools, complete technical documentation and post design-in support through a global sales and distribution network.16-bit PIC Microcontrollers & dsPIC Digital Signal Controllers. Microchip offers two 16-bit Microcontroller (MCU) families plus two 16-bit Digital Signal Controller (DSC) families that give you compatible options across a wide spectrum of price, performance and feature sets.
PIC24FJ256GB110-I/PF is part of the PIC24F Series family with 256 kB Flash as a 16-Bit Flash Microcontroller.It can sustain standard temperature ranges from -40°C to 125°C and has 100 pin in a TQFP package. This device is lead free.
Ideal for low power (<100 nA standby current) and connectivity applications that benefit from the availability of multiple serial ports (3xI2C, 3xSPI), 4xUARTS, and 23 independent timers. Large amounts of RAM (16 kB) memory for buffering and large (up to 256 kB) Enhanced Flash program memory make it ideal for embedded control and monitoring applications. PPS (Peripheral Pin Select) aids in configuring the most efficient pin configuration of available I/O, and CTMU provides touch sensing support for up to 64 individual buttons. Available in 64, 80, and 100 pin packages.
Features:
To learn more about the PIC24FJ256GB110 product family, Click Here.
Sur commande
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.