Référence fabricant
BCR169E6327HTSA1
AF Discretes
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23 (SC-59,TO-236) Méthode de montage :Surface Mount | ||||||||||
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Infineon BCR169E6327HTSA1 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Detailed change informationSubject: Introduction of additional plating production at Wuxi Welnew Microelectronic Co., Ltd., Wuxi, China for several productsReason/Motivation:Expansion of plating production to assure continuity of supply and enable flexible manufacturing by recovery of Welnew Wuxi Plating site for DS products (PCN 2023-034-A) DescriptionOldShanghai Welnew Microelectronic Co., Ltd., Shanghai, ChinaNewShanghai Welnew Microelectronic Co., Ltd., Shanghai, ChinaWuxi Welnew Microelectronic Co., Ltd., Wuxi, ChinaIntended start of delivery: 2026-06-20Last order date (LOD): 2026-06-20Last delivery date (LDD): 2026-12-20
Statut du produit:
Infineon BCR169E6327HTSA1 - Caractéristiques techniques
| Polarity: | PNP |
| R1, R2: | 4.7kΩ |
| Collector Current Max: | 0.1A |
| CE Voltage-Max: | 50V |
| Power Dissipation-Tot: | 0.2W |
| Collector - Base Voltage: | 50V |
| Collector - Emitter Saturation Voltage: | 0.3V |
| DC Current Gain-Min: | 120 |
| Configuration: | Single |
| Collector - Current Cutoff: | 100nA |
| Frequency - Transition: | 200MHz |
| Style d'emballage : | SOT-23 (SC-59,TO-236) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23 (SC-59,TO-236)
Méthode de montage :
Surface Mount