Référence fabricant
25LC640A-E/ST
25LC640A Series 64 Kbit (8K x 8) 5.5 V SMT SPI Bus Serial EEPROM - 8-TSSOP
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube | ||||||||||
| Code de date: | |||||||||||
Microchip 25LC640A-E/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of 36.5K process technology for selected products of the 25AA640A and 25LC640A device families. Impacts to Data Sheet: NoneChange Impact: None Reason for Change: To improve manufacturability by qualifying an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date:December 01, 2021 (date code: 2149)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Microchip has released a new Product Documents for the 25AA640A/25LC640A 64K SPI Serial EEPROM Data Sheet of devices. Notification Status: FinalDescription of Change: 1) Added a note to Table 1-2 that explains the array architecture and how endurance is specified. 2) Switched Sections 2.0 and 3.0 and updated Table 2-1. 3) Updated packaging outline drawings4) Corrected Extended (E) temperature label5) Added Automotive product identification table6) Made minor formatting and grammar edits.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 30 Jun 2021
Description of Change: Qualification of ASSH as a new assembly site for selected 25AA640xx and 25LC640xx device families of 36K wafer technology available in 8L TSSOP package.Pre Change:Assembled at ANAP using gold (Au) bond wire, 8290 die attach material, G700A molding compound material, with Matte tin lead plating finish and using lead frame without lead lock Assembled at UNIS using gold (Au) bond wire, 8290 die attach material, G600 molding compound material, with Matte tin lead plating finish and using lead frame without lead lock Assembled at NSEB using gold (Au) bond wire, 2200D die attach material, G600 molding compound material, with Matte tinlead plating finish and using lead frame with lead lock Assembled at MMT using gold (Au) bond wire, 2200D die attach material, G600V molding compound material, with Matte tin lead plating finish and using lead frame without lead lockPost Change:Assembled at ANAP using gold (Au) bond wire, 8290 die attach material, G700A molding compound material, with Matte tin lead plating finish and using lead frame without lead lock Assembled at UNIS using gold (Au) bond wire, 8290 die attach material, G600 molding compound material, with Matte tinlead plating finish and using lead frame without lead lock Assembled at NSEB using gold (Au) bond wire, 2200D die attach material, G600 molding compound material, with Matte tin lead plating finish and using lead frame with lead lock Assembled at MMT using gold (Au) bond wire, 2200D die attach material, G600V molding compound material, with Matte tin lead plating finish and using lead frame without lead lock Assembled at ASSH using palladium coated copper (PdCu) bond wire, EN-4900GC die attachReason for Change:To improve on-time delivery performance by qualifying ASSH as a new assembly site. Estimated First Ship Date: March 23, 2021 (date code: 2113)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
100 par Tube