Pays de livraison
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Pays sélectionné
Référence fabricant
24LC64T-I/SM
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
2100 par Reel
SOIJ-8
Surface Mount
Informations de livraison:
Le pays d’origine (COO) est attribué au moment de l’expédition et ne peut pas être sélectionné lors du processus de commande. Tous les documents indiqueront le COO au moment de l’expédition.
Code HTS:
ECCN:
Informations PCN:
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
Description of Change:Qualification of QMI-519 die attach material at MTAI assembly site for 24LC32A/SM, 24LC32A-E/SM, 24AA32AT-I/SM, 24LC32AT/SM, 24AA64T-I/SM, 24LC64T-E/SM, 24AA32AT/SM, 24LC64T-I/SM, 24FC64-I/SM, 24FC64T-I/SM, 24LC64-I/SM, 24LC64-E/SM, 24AA64-I/SM, 24AA32A-I/SM, 24LC32A-I/SM, 24LC32AT-I/SM, 24LC32AT-E/SM, 24AA64T-E/SM and 24AA64-E/SM catalog part numbers (CPN) available in 8L SOIJ (.208in) package.Reason for Change:To improve manufacturability and on time delivery performance by qualifying QMI-519 die attach material at MTAI assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Description of Change:1. Updated TABLE 1-1: DC CHARACTERISTICS.2. Editorial updates throughout document.Reason for Change: To improve productivity.
Statut du produit:
It has been developed for advanced, lowpower applications.
Features:
Applications:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.