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The next level of simplicity and safety in high voltage auxiliary power supplies
Infineon’s first SiC MOSFET portfolio in 1700 V class in SMD packaging is targeting the auxiliary power supply circuit, which generates power for control logic, displays and cooling fans in three-phase power systems.
The Infineon CoolSiC™ is the industry’s preferred practice for such low-power applications – the single-ended fly-back topology – which can now be used even up to 1000 VDC input voltage. The Infineon 1700V blocking voltage eliminates design concerns on voltage stress margin and reliability of power supply. With CoolSiC MOSFET technology, low on-resistance and device capacitances compared to 1500V Si MOSFETs result in more than 50% loss reduction and enables compact SMD integration using natural convection cooling without a heatsink.
The new 1700V CoolSiC™ trench MOSFETs by Infineon are optimized for fly-back topologies with +12 V / 0 V gate-source voltage compatible with common PWM controllers, and thus there is no need for a gate driver IC. The new D2PAK-7L package fulfills 1700 V safety requirements with >7 mm creepage and clearance distances, which minimizes isolation effort in the PCB design.
Browse Infineon Technologies SiC MOSFETs
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