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Manufacturer Part #
PIC16LF1509-I/SS
PIC16 Series 14 KB Flash 512 B RAM 20 MHz 8-Bit Microcontroller - SSOP-20
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:67 per Tube Package Style:SSOP-20 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC16LF1509-I/SS - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Datasheet for the PIC16(L)F1508/9 20-Pin Flash, 8-Bit Microcontrollers with XLP Technology Data Sheet of devices. If you are using one of these devices please read the document located at PIC16(L)F1508/9 20-Pin Flash, 8-Bit Microcontrollers with XLP Technology Data Sheet.Notification Status: FinalDescription of Change: Updated Table 1-2; Section 5.5.3; and Figure 29-6.Impacts to Data Sheet: See above detailsReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 10 Aug 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new Errata for the PIC16(L)F1508/1509 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC16(L)F1508/1509 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Removed DS Clarifications for previous data sheet revision. Updated data sheet revision letter to F.Impacts to Data Sheet: NoneReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 10 Aug 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC16LF1509-I/SS&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--microcontrollers--8-bit/pic16lf1509-i-ss-microchip-9019669
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC16LF1509-I/SS&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--microcontrollers--8-bit/pic16lf1509-i-ss-microchip-9019669
Microchip PIC16LF1509-I/SS - Technical Attributes
| Family Name: | PIC16 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 14kB |
| RAM Size: | 512B |
| Speed: | 20MHz |
| No of I/O Lines: | 18 |
| InterfaceType / Connectivity: | I2C/I2S/SPI/USART |
| Peripherals: | Analog Comparators/I2C/I2S/On-Chip-ADC/PWM/SPI/USART/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 1.8V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 12-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SSOP-20 |
| Mounting Method: | Surface Mount |
Features & Applications
The PIC16LF1509-I/SS is a part of PIC16 series 512 Byte RAM 8-Bit Flash Microcontroller with nanoWatt XLP Technology and its Available in a SSOP-20 Package.
Product Features:
- High Performance RISC CPU
- Flexible Oscillator Structure
- Special Microcontroller Features:
- 1.8 V to 3.6 V
- Self Programmer under Software Control
- Power-on Reset
- Programmable Code Protection.
- Extreme Low-Power Management with nanoWatt XLP
- Peripheral Features:
- Analog to Digital Converter
- 2 Comparators
- Voltage Referance module
Available Packaging
Package Qty:
67 per Tube
Package Style:
SSOP-20
Mounting Method:
Surface Mount