Référence fabricant
MIC94345-SYMT-TR
MIC94345 Series 3.3 V 500 mA Surface Mount Positive Fixed LDO - TDFN-6
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :TDFN-6 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC94345-SYMT-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
**** Update for PCN 113167/LOCATION AND MATERIAL CHANGE****Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC94355, MIC94305, MIC94325 and MIC94345 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: November 2025Revision History: May 19, 2025: Issued initial notification.September 11, 2025: Re-issued initial notification to update the die attach material from ATB-F125E to CDF215.
*** Update for PCN 112974 ***Revision History: May 13, 2025: Issued initial notification.July 23, 2025: Issued final notification. Attached Qualification Report. Provided estimated first ship date to be on July 31, 2025.Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC94345, MIC2095, MIC2097, MIC2098, MIC2099, MIC23030, MIC23031, MIC2791, MIC5265, MIC5301, MIC5304, MIC5308, MIC5309, MIC5318, MIC5320, MIC5321, MIC5322, MIC5335, MIC5353, MIC5367, MIC5368, MIC5370, MIC5371, MIC5512, MIC5514, MIC826, MIC841, MIC94305, MIC94325 and MIC94355 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.Estimated First Ship Date: 31 July 2025 (date code: 2531)
Description of Change: Qualification of ATP7 as an additional assembly site for selected MIC94355, MIC94305, MIC94325 and MIC94345 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying ATP7 as an additional assembly site.Estimated Qualification Completion Date: November 2025
Description of Change: Qualification of STAR as an additional final test site and scan and pack site for selected MIC94345, MIC2095, MIC2097, MIC2098, MIC2099, MIC23030, MIC23031, MIC2791, MIC5265, MIC5301, MIC5304, MIC5308, MIC5309, MIC5318, MIC5320, MIC5321, MIC5322, MIC5335, MIC5353, MIC5367, MIC5368, MIC5370, MIC5371, MIC5512, MIC5514, MIC826, MIC841, MIC94305, MIC94325 and MIC94355 device families available in 6L UDFN (1.6x1.6x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying STAR as an additional final test site and scan and pack site.
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Microchip has released a new Datasheet for the 500 mA LDO with Ripple Blocker Technology of devices.Description of Change: Changed all references to Thin DFN or TDFN throughout data sheet to Ultra Thin DFN or UDFN. Updated package outline drawings to correct UDFN PODs. Minor text and format changes throughout.Reason for Change: To improve productivity.
Statut du produit:
Microchip MIC94345-SYMT-TR - Caractéristiques techniques
| Input Voltage-Min: | 1.8V |
| Input Voltage-Max: | 3.6V |
| Output Voltage Fixed: | 3.3V |
| Dropout Voltage-Max: | 200mV |
| Output Current-Max: | 500mA |
| Style d'emballage : | TDFN-6 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
TDFN-6
Méthode de montage :
Surface Mount