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Référence fabricant
MIC94066YML-TR
MIC94066 Series 5.5 V 115 mOhm Surface Mount Dual High Side Power Switch - MLF-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC94066YML-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
***UPDATE OF PCN112600 & PCN112910***Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.Estimated First Ship Date: 18 July 2025 (date code: 2529)Revision History: April 29, 2025: Issued initial notification.May 14, 2025: Re-issued initial notification to update the dimensions of the T/R antistatic shield bag of UNIG from inches to mm for both length and width and mils to mm for thickness.July 02, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on July 18, 2025.
******FPCN112600 UPDATE******Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8LVDFN(2x2x0.9mm).***Re-issued initial notification to update the dimensions of the T/R antistatic shield bag of UNIG from inches to mm for both length and width and mils to mm for thickness***Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
Description of Change: Qualification of UNIG as an additional final test location and scan and pack for selected MIC23051, MIC23050, MIC2293, MIC47100, MIC94068, MIC94069, MIC5310, MIC5330, MIC94067, MIC94066, MIC2288, MIC2291, MIC2287, MIC2287C, MIC2296, MIC2606, MIC2605, MIC2602, MIC2601, MIC2295, MIC2292C, MIC2292, MIC2290, MIC2289, MIC2293C, MIC44F18, MIC3287, MIC44F20, and MIC44F19 device families available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC94066YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--analog--power-switches/mic94066yml-tr-microchip-8401820
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC94066YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--analog--power-switches/mic94066yml-tr-microchip-8401820
Microchip MIC94066YML-TR - Caractéristiques techniques
| Configuration: | High Side |
| No of Elements: | Dual |
| On-state Resistance-Max: | 115mΩ |
| Rated Current-Max: | 2A |
| Style d'emballage : | MLF-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-8
Méthode de montage :
Surface Mount